BLUEWINDIA TECH CO.,Ltd Address: Room101, Building 3, NO.1168 Nanyuan West Road, Qidong City Jiangsu Province
Tel: 0513-83319515 Fax: 0513-83106828 E-mail:china@bluewindia.com
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Back Wafer Processing Wheel A precision processing diamond tool to grind back wafer, an unnecessary part after FAB process, in order to maintain a consistent wafer thickness and produce excellent surface profile |
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CMP PAD CONDITIONER Continuously conditioning front pad to polish wafer and evenly distribute slurry on the front pad |